Solder alloy and joint thereof

ABSTRACT

A silver electrode joint having a high joint strength obtained by actively minimizing the particle size of a silver-zinc intermetallic compound at the solidification point. A joint obtained by joining an article to be joined, the joint including silver at least as the surface layer thereof, using a solder alloy which comprises 2-9 wt % of zinc, 0.0001-0.1 wt % of manganese and the balance consisting of tin, the solder joint having a joint interface wherein the particle size of a silver-zinc intermetallic compound, which is formed by silver being the surface layer of the article to be joined and zinc in the solder alloy, is 5 μm or less.

TECHNICAL FIELD

The present invention relates to an improved technology by which a stable and firm joint boundary can be obtained when a Cu alloy terminal is joined to an Ag electrode in a Sn—Zn based solder, and particularly, to a solder alloy and its joint suitable for a joining solder for joining a Cu alloy terminal component to the Ag electrode fixed on a glass surface.

BACKGROUND ART

A Pb free solder alloy is on the main stream in view of consideration to an environmental aspect in recent years, and a Sn—Zn based solder alloy is known as one of those types.

An application of the solder alloy is to join metal and metal to each other at a relatively low melting point, but particularly if the metal to be joined has a composition not contained in the solder alloy, the metal to be joined elutes into a molten solder during a soldering operation, that is, a so-called erosion phenomenon occurs. A copper erosion phenomenon or a silver erosion phenomenon occurs when a target to be joined is Cu or Ag, respectively, and an intermetallic compound is formed of the eluting metal and apart of the solder alloy composition particularly on a joint boundary and are fixed thereto with solidification. Generation of the intermetallic compound between the metal eluting from the soldering target and the metal contained in the solder alloy is unavoidable in soldering, and the generation itself has no problem. However, if a grain size when the generated intermetallic compound is solidified is relatively large, it causes deterioration to chronologically progress on the joint boundary. That is, in the intermetallic compound formed of a plurality of types of metal, Kirkendal voids appear due to a difference in diffusion speeds of metal atoms, and there is a concern that the void chronologically develops into a crack due to an external factor such as an external stress, a heat cycle and the like, which might result in breakage of the joint boundary in the end.

If the grain size of the intermetallic compound is large, particularly the difference in the diffusion speeds of the metal atoms is considered to have a great influence and to raise a probability of occurrence of the Kirkendal voids. Therefore, even if the Sn—Zn-based solder is selected, a solidification grain size of an intermetallic compound on the joint boundary is preferably as small as possible depending on the joint.

CITATION LIST Patent Literature

Patent Literature 1: Japanese Patent Laid-Open No. 2000-15478

Patent Literature 2: Japanese Patent Laid-Open No. 2000-280066

Patent Literature 3: Japanese Patent Laid-Open No. 2011-156558

Patent Literature 4: U.S. Pat. No. 6,936,219

SUMMARY OF INVENTION Technical Problem

Patent Literature 1 describes compositions containing a small amount of an addition in the Sn—Zn base, and Mn is exemplified as the added element. It is described that by means of these compositions, stability of the Sn—Zn solder is improved when they are prepared to a solder paste, and a chronological change of the solder after joining can be suppressed. However, this known technology does not specify the composition of the joint and does not consider generation of the intermetallic compound between the solder composition and the joint composition.

Patent Literature 2 discloses a technology in which, similarly to Patent Literature 1, Sn—Zn is a main component and Mn is added thereto as a type of deoxidizing element based on a fact that manganese strongly reacts with oxygen. It also describes finding of high solder joining characteristics to a metallic electrode on glass as a result.

Patent Literature 3 describes a solder alloy constituted by 0.01 to 10 weight % of Zn, 0.1 weight % or less of Mn and the remaining Sn. Moreover, in addition to metallic materials such as Cu, Ni and the like which are materials of prior-art electronic components and a solder joint portion of a printed circuit board, it describes high solder joining characteristics to a metallic electrode on glass. However, this known technology assumes solder joining characteristics mainly with Al.

Patent Literature 4 discloses use of the Sn—Zn alloy containing Mn 0.001 to 0.9 weight % as the solder alloy. This known technology does not consider the intermetallic compound generated between the solder composition and the joint composition similarly to other known technologies.

The present invention is to obtain an Ag electrode joint with high joining strength by actively minimizing the grain size of this intermetallic compound at solidification based on a fact that, on the premise of generation of joint to the Ag joint by using the Sn—Zn-based solder composition, the intermetallic compound of AgZn is generated between Zn in the solder composition and Ag eluting from the joint and constitutes apart of the joint boundary.

Conventionally, in order to join a terminal component to an Ag joint fixed to a window pane of an automobile or particularly to a rear windshield, a tin-lead based solder or a tin-indium based solder has been used, but the solder containing lead as the tin-lead base is not to be used as much as possible in recent years. Moreover, in the case of the tin-indium based one, a melting point of the solder alloy is low, and an alloy composition grows chronologically and thus, reliability cannot be guaranteed easily. Moreover, it has problems that mechanical strength is low, indium is expensive and the like.

Solution to Problems

In order to achieve the aforementioned object, the present invention uses a solder alloy for joining a joint in which at least a surface layer is Ag, the solder alloy being composed of 2 to 9 weight % of Zn, 0.0001 to 0.1 weight % of Mn, and the remaining of Sn. Ag that is present in the surface layer of the joint is molten into the solder by erosion during soldering, combines with Zn contained in the solder composition and generates an AgZn intermetallic compound. As a result, the AgZn intermetallic compound constitutes a boundary between the joint and the solder and exhibits a function as a barrier layer suppressing further elution of Ag. Sn and Zn are eutectic at Sn91 weight % of in binary. If the content of Zn is 1 weight %, silver erosion beyond assumption occurs, but the content is 2 weight %, an expected effect of suppressing silver erosion can be ensured at the minimum. A lower limit value of Zn was set to 2 weight % by considering that. On the other hand, if too much Zn is contained, erosion progresses and thus, an upper limit was set to 9 weight %. A melting point at an eutectic point of Sn and Zn is 198.5° C., but the melting point in the present invention does not have to be as low as the eutectic point of Sn and Zn from an industrial viewpoint, and thus, the eutectic is not given importance in setting the upper limit value. Or rather, as the result of attention paid to suppression of silver erosion as the purpose of the present invention, the upper limit value of Zn was set to 9 weight % which is the eutectic point.

The inventors did not confirm presence of Mn added in a slight amount in the joint boundary but considered that, in a growth process of the AgZn intermetallic compound, Mn diffused in a molten solder has some influence to a difference in diffusion speeds of Ag and Zn so that growth of the AgZn intermetallic compound in a solidification process is suppressed and coarsening of a crystal grain size is hindered, and thus they added it in a slight amount to the alloy. Regarding the contents, Mn does not constitute eutectic neither with Sn or Zn at least within a range of a mixed amount set, respectively. However, if 0.01 weight % is exceeded, an effect of addition gradually lowers and thus, 10 times of the content was set to be the upper limit. Regarding the lower limit value, it was confirmed that, even if Mn is added in a slight amount, the effect of suppressing the grain size of the AgZn intermetallic compound is exhibited, but since an amount lower than 0.0001 weight % is technically difficult as a range that can be properly contained industrially, this value was set to be the lower limit value.

The joint is obtained by using the solder alloy having the aforementioned composition, but in this case, Ag is precipitated from the surface layer of the joint, combines with Zn in the solder alloy and forms the AgZn intermetallic compound. Here, by diffusing Mn in an appropriate amount into the molten solder, the joint boundary having the grain size of the AgZn intermetallic compound at 5 μm or less can be obtained.

Moreover, in order to set the grain size of the AgZn intermetallic compound present in the joint boundary to the preferable 5 μm or less, a method of applying so-called preliminary soldering was used in which solder plating is applied to both joint surfaces of two joints using the solder alloy similarly having the aforementioned composition and the solder plating is heated/molten and solidified while the solder plating are brought into contact with each other. If the preliminary soldering is not applied, materials with three different compositions, that is, the Cu alloy terminal, the Ag electrode, and the solder alloy of the present invention are to be joined, but in order to join them in one procedure, a condition satisfying both compatibility of the composition and compatibility of a shape at the same time is needed. In the preliminary soldering in the present invention, the solder alloy is applied on the Cu alloy terminal and the solder alloy on the surface of the Ag electrode in advance, and as a result, when the Cu alloy terminal is to be joined to the Ag electrode, the solder alloys with the same composition are molten/joined to each other, and a firmer joint can be obtained. Moreover, at the time of preliminary soldering, a joint temperature of the preliminary solder to the Ag electrode can be lower than a temperature at which the preliminary soldering is applied to the Cu alloy terminal and thus, excessive heat energy is not given to the Ag electrode and the solder alloy, and prevention of coarsening of the grain size of the AgZn intermetallic compound can be expected. Moreover, since preliminary soldering is applied to the Cu alloy terminal and the Ag electrode, respectively, the AgZn intermetallic compound is generated in the boundary between the Ag electrode and the preliminary solder, the CuZn intermetallic compound is generated in the boundary between the Cu alloy terminal and the preliminary solder, and as a result, the composition of the preliminary solder transfers to tin rich which is a base material. That is, since Zn has decreased on the surfaces of the both preliminary solder, soldering can be performed at a temperature closer to the melting point of Sn.

Moreover, in joining of the joint to which solder plating is applied in advance, it is only necessary that the heating temperature is 230° C. at which the solder alloy is molten or more and that a temperature range in which nonconformity such as oxidation of the molten solder alloy or the like does not occur or at 300° C. or less, for example, is acceptable. However, in the case of a ternary alloy of the present invention with a content of 2 to 9 weight % of Zn and a slight amount of Mn added, a highest melting point is approximately 230° C. even in the case of 2 weight % of Zn, and in order to reliably melt it and to obtain a stable joint boundary, overheating at approximately 20° C. is required, and a heating temperature at 250° C. is more preferable. However, the aforementioned heating temperature is not a set temperature in a strict meaning but is set by considering a melting point of a solder alloy to be used.

Advantageous Effects of Invention

In the present invention, the solder alloy, in which 2 to 9 weight % of Zn with respect to Sn is contained and furthermore 0.0001 to 0.1 weight % of Mn is added in a slight amount, is employed so that Mn is diffused in the molten solder, and the crystal grain size can be made to 5 μm or less when the intermetallic compound of Ag and Zn eluting from the joint target is generated. As a result, occurrence of Kirkendal voids is suppressed, and development of this Kirkendal voids into a crack can be prevented. Therefore, the joint using the solder alloy of the present invention can prevent excessive elution of Ag from the joint surface and can obtain a composition with high joint reliability.

In the present invention, when the joint is to be obtained by using the aforementioned solder alloy, the solder plating with the same composition is applied in advance to both the joint surfaces of the two joints, and the solder platings are heated/molten while the solder platings are brought into contact with each other so as to manufacture the solidified solder joint and thus, occurrence of voids in the joint boundary can be effectively suppressed. Since the preliminary soldering is applied to each of the Cu alloy terminal and the Ag electrode separately, the preliminary soldering can be fixed under the respective appropriate temperature conditions and the like and moreover, since particularly Ag erosion is prevented by the joint boundary made of the intermetallic compound generated in each of them, occurrence of the Kirkendal voids caused by the diffusion speed of the metal can be suppressed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an analysis photo obtained by soldering a solder alloy of the present invention to an Ag electrode provided on a glass substrate so as to constitute a joint.

FIG. 2 is a graph in which a status of silver erosion of a composition of the present invention is compared with that of another composition.

FIG. 3 is a graph in which the composition of the present invention and another composition are both subjected to a heat cycle test and occurrence degrees of a crack are shown.

FIG. 4 is a graph illustrating a result of a tension test of the same.

FIG. 5 is a graph illustrating a creep characteristic of the same.

FIG. 6 is a schematic view illustrating a procedure of applying solder plating in advance to a joint together with a comparative example.

FIG. 7 is a comparative photo illustrating the occurrence degrees of voids of a joint to which the solder plating is applied in advance and a joint without the solder plating.

DESCRIPTION OF EMBODIMENT

A preferred embodiment of the present invention will be discussed below on the basis of Examples. FIG. 1 is a photo of a sectional structure of a state in which preliminary soldering was applied and then, solder joining was performed using a solder alloy of the present invention. A composition of the preliminary solder was 91.853Sn-8.14Zn-0.0070Mn (weight %), and soldering was performed with an iron-tip set temperature at 250° C. The composition shows a solder layer 1 made of a Sn—Zn composition, a joint boundary layer 2 made of an AgZn intermetallic compound, and an electrode layer 3 made of Ag from the lowest layer.

EXAMPLE

In a mode illustrated in FIG. 1, it was confirmed whether or not a difference is found in strength depending on a difference in a grain size of the AgZn intermetallic compound appearing in the joint boundary layer 2. The difference in strength was confirmed by visually checking a state of a crack occurring on the joint boundary after a durability test was conducted. The durability test was conducted such that a test piece in which the Ag electrode is baked on a glass plate and a terminal in which Sn plating is applied on a Cu alloy base material corresponding to a Cu alloy terminal were joined to each other, a heat cycle test was conducted and then, a sectional structure of a joint portion was observed, and presence of occurrence of a crack was examined. The result is shown in Table 1.

TABLE 1 Average grain size of AgZn Presence of a crack in the crystal grain (μm) solder after a durability test 20 Yes 10 Yes 5 No 3 No 1 No

The test piece had a size of 8×8×3 mm, a thickness of the Ag layer was 20 μm, the terminal had a size of 4×7×0.4 mm in which Sn plating was applied to a surface of pure copper, and the preliminary solder was added in an amount of 4.5×7.5×0.2 mm in volume. The heat cycle in which −30° C. was maintained for 30 minutes and the temperature was raised up to +80° C. and maintained for 30 minutes was repeated 1000 times.

As the result of the test, no crack was confirmed in a specimen of the AgZn intermetallic compound with an average grain size of 5 μm or less, while a crack was observed in specimens with the average grain sizes of 20 μm and 10 μm. This experiment is based on a premise that if there is a void inside the boundary, it develops to a crack by a heat cycle.

FIG. 2 shows a result in a graph obtained by immersing an Ag wire having a diameter of 0.25 mm and a length of 10 mm to a half of six types of solder baths with different compositions and by measuring a remaining length every predetermined time. A molten solder temperature was 300° C. In the experiment, the specimen 91Sn9Zn within the range of the present invention showed extremely favorable anti-silver erosion, and 93Sn7Zn and 92.99Sn7Zn0.01Mn also showed favorable anti-silver erosion performances. However, in the other specimens, approximately 2 mm were lost by erosion after approximately 50 seconds have elapsed. From this fact, it was confirmed that the solder composition containing 7 to 9 weight % of Zn with Sn as the base material presented favorable anti-silver erosion performances.

A graph in FIG. 3 shows a result of a heat cycle test obtained by repeating 90 cycles within a range of 90 degrees to −40° C. using a test piece made of seven types of compositions. As the test piece, a material obtained by soldering a solder foil having a width of 5 mm, a length of 10 mm, and a thickness of 0.6 mm to a surface of a silver electrode (foil thickness of approximately 15 μm) on a glass surface having a width of 50 mm, a length of 100 mm, and a thickness of 5 mm was used. As a result, when 93Sn7Zn is compared with 92.992Sn7Zn0.008Mn with a slight amount of Mn added, appearance of cracks was less in the specimen with Mn added, and similarly when 95Sn5Zn and 94.997Sn5Zn0.003Mn are compared, it was also confirmed that appearance of cracks was less in the specimen with Mn added. From these relations, it can be understood that appearance of cracks can be reduced by obtaining a joint by employing a solder alloy with the composition with addition of Mn in the solder with the Sn—Zn composition. In crack check, the test piece was taken out in the middle of the heat cycle test, a soldered spot was observed from a rear surface the glass with a stereo microscope 10 magnifications), and the number of cracks detected on the glass surface was counted. That is, check of the strength of the joint boundary was replaced by comparison of generated stresses caused by a difference in a coefficient of thermal expansion between the glass including the silver electrode and the solder.

A graph in FIG. 4 shows a result of a tension test of test pieces made of six types of compositions. In a test method, the test pieces obtained by melting the compositions at a liquid phase temperature +100° C. in an electric furnace and a graphite crucible and by casting them in a casting die at a room temperature were used. The test pieces were prepared into a size of a whole length of 170 mm, a parallel part length of 60 mm, a width of 10 mm, and a thickness of 10 mm, and the test pieces were pulled with a force of tensile strength of 10 mm/minute by every 25 mm from a center of the test pieces at a room temperature, that is, an inter-mark distance of 50 mm. The measurement complies with JIS (Japan Industrial Standard). As a result, the specimen of 92.992Sn7Zn0.008Mn within the range of the present invention exhibited the most favorable resistance against tension. A largely favorable tensile strength was also shown by 93Sn7Zn without Mn addition. That was caused by fragmentation of the solder composition by addition of the slight amount of Mn. From these facts, it is considered that occurrence of Kirkendal voids in the vicinity of the joint boundary was suppressed, and a uniform structure could be obtained even if the joint was obtained by employing the solder alloy with Mn addition.

A graph in FIG. 5 shows a creep characteristic, and the test method in which a load of 30 kg was applied to the test piece prepared similarly to FIG. 4 under a temperature atmosphere of 100° C. was used, and the test was conducted twice each for four types of specimens. The inter-mark distance was 50 mm. As a result, the test piece with Mn addition showed the most favorable creep characteristic similarly to the tensile test result in FIG. 4.

Subsequently, FIG. 6 is a schematic view for explaining the case in which the preliminary soldering with the composition having been already described is performed, in which reference numeral 10 denotes the Ag electrode provided on the surface of the glass plate, reference numeral 11 denotes the preliminary solder on the Ag electrode 10 side with solder plating applied, 12 denotes the Cu alloy terminal, and 13 denotes the preliminary solder provided on the joint surface of the Cu alloy terminal and also with solder plating applied. Reference numeral 14 shows a solder iron. In a process, while solder plating applied to the both are brought into contact with each other as illustrated in FIG. 6 left side, the solder iron 14 is brought into contact on a rear surface side of the solder plating of the Cu alloy terminal 12 and heated to approximately 250° C. Then, the both solder platings are molten, and a joint portion 15 of the solder is formed as illustrated in FIG. 6 right side. In FIG. 6 right side, the joint boundary actually appears both on the Ag electrode 10 side and the Cu alloy terminal 12 side, but they are not shown. By employing this method, since flux is not needed, a void inevitably generated at boiling/evaporation of the flux can be avoided. A joint joined in this way is shown in comparison with a joint joined without applying the preliminary solder in FIG. 7. FIG. 7 is a radiographic photo obtained by irradiation of X-rays in order to confirm the state inside the solder joint, and little occurrence of a void was found in the specimen to which the preliminary soldering was applied, while a plurality of voids were found in all the specimens to which the preliminary soldering was not applied.

REFERENCE NUMERALS

-   1 Solder layer -   2 Joint boundary layer -   3 Ag electrode layer -   10 Ag electrode -   11, 13 Solder plating -   12 Cu alloy terminal -   15 Joint portion 

1. A solder joint, comprising: a joint in which at least a surface layer is silver is joined by a solder alloy composed of 2 to 9 weight % of zinc, 0.0001 to 0.1 weight % of manganese, and a remainder of tin, wherein the solder joint has a joint boundary in which a a silver-zinc intermetallic compound formed of Ag silver of the surface layer of the joint and zinc in the solder alloy has a grain size of 5 μm or less.
 2. The solder joint according to claim 1, wherein a solder plating with the solder alloy is applied in advance to a first joint surface and a second joint surface of the joint, and the first solder plating and the second solder plating are heated to be molten while the first solder plating and the second solder plating are brought into contact with each other, and then solidified.
 3. The solder joint according to claim 2, wherein a heating/melting temperature is 230° C.-300° C.
 4. A solder joining method, comprising: plating a first joint surface and a second joint surface of a joint to have a solder plating in which at least a surface layer is silver and is plated in advance with a solder alloy composed of 2 to 9 weight % of zinc, 0.0001 to 0.1 weight % of manganese, and a remainder of tin; and heating the solder platings on the first joint surface and the second joint surface to be molten while bringing the solder platings into contact with each other; and cooling the solder platings until the solder platings are solidified.
 5. The solder joining method according to claim 4, further comprising forming a silver-zinc intermetallic compound of silver of the surface layer of the joint and zinc in the solder alloy, such that the intermetallic compound has a grain size of 5 μm or less.
 6. The solder joining method according to claim 4, wherein heating includes heating to a is 230° C.-300° C. 